Thermal Design Elements
- Specially designed PCB board and PCB board material to improve heat dissipation.
- LED drivers located on the front of the tile
- LED tile sealed and filled front and back with heat conductive potting material.
- The back of the LED tile is completely filled (no Air gap) between the PCB board and the enclosure.
- Power Supplies are also fanless and are enclosed in a sealed control box with the Data Cards.
- Open Module Enclosure allows air flow.