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Thermal Heat Management

Thermal Design Elements

  • Specially designed PCB board and PCB board material to improve heat dissipation.
  • LED drivers located on the front of the tile
  • LED tile sealed and filled front and back with heat conductive potting material.
  • The back of the LED tile is completely filled (no Air gap) between the PCB board and the enclosure.
  • Power Supplies are also fanless and are enclosed in a sealed control box with the Data Cards.
  • Open Module Enclosure allows air flow.

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